M1AFS250-1FG256I vs M1AFS250-2FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-1FG256I par Microchip Technology et M1AFS250-2FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActifMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-1FG256I | M1AFS250-2FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $96,50 | $83,12 |
| Series | Fusion (M1 - with ARM Cortex-M1) | — |
| System Gates | 250000 gates | 250000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | ARM Cortex-M1 |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Température de fonctionnement | -40C to +85C (industrial, suffix I) | -40C to +85C (industrial, I grade) |
| Speed Grade | -1 | -2 |
| Boîtier | 256-LBGA (FBGA) | 256-ball FBGA (FGG256) |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Type de montage | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Family | — | Actel Fusion (Mixed-Signal FPGA) |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Security | — | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Statut RoHS | — | Compliant (FGG = Pb-free balls) |