M7AFS600-1FG484I vs M7AFS600-FG484I Comparison
Detailed side-by-side comparison of M7AFS600-1FG484I by Microchip Technology and M7AFS600-FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ ActiveMicrochip Technology
M7AFS600-FG484I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-FG484I ✓ ActiveSpecification Comparison
| Parameter | M7AFS600-1FG484I | M7AFS600-FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $273.98 |
| System Gates | 600000 | 600K |
| Programmable Logic Tiles | 110592 | — |
| User I/O | 172 | 172 |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) | Fusion (Mixed-Signal FPGA) |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS | 130 nm |
| Configuration Memory | Nonvolatile Flash, retains program when powered off | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Supply Voltage (Core) | 1.5 V | — |
| Logic Family | CMOS | — |
| Speed Grade | 1 | — |
| Package | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm | 484-Ball FBGA (FG484) |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature | Industrial, -40C to +85C | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount |
| Embedded Processor Support | ARM CoreMP7 | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | — | 1098.9 MHz |
| Embedded Flash (Configuration/System) | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V |
| Processor Support | — | ARM CoreMP7 |
| Configuration Type | — | Flash-based (live at power-up) |
| Analog Peripherals | — | Yes (mixed-signal front end) |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Packaging | — | Tray |
| Lifecycle Status | — | Active (per Microchip/Microsemi product lines) |