Microchip Technology

M7AFS600-FG484I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

MPN: M7AFS600-FG484I ✓ Active
In Stock Ships in 1-3 business days
1.5 V Vdss 484-Ball FBGA (FG484) Package 1098.9 MHz Speed 110592 bits Memory
From $273.98 USD / Unit
MOQ: 1 |
Price updated: 2026-09-01
Volume Pricing
Qty Unit Price Extended
1 $289 $289.00
10 $284 $2,840.00
100 $278 $27,800.00
500 $275.5 $137,750.00
1,000 $273.98 $273,980.00
ℹ️ All prices are in USD

Drop-in alternatives for M7AFS600-FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

M7AFS600-FGG484I

✅ Drop-In
Microchip Technology
📦 484-Ball FBGA (FGG484)
Fusion (Microsemi/Actel, now Microchip) · 600000 gates · ARM CoreMP7 (ARM7TDMI-compatible) · 172 I/O · Flash-based, on-chip · 1.5 V · 484-BGA (FGG484), 1.0 mm ball pitch · Surface Mount

✓ In Stock

$219.2 / Unit

View Datasheet →

M7AFS600-1FG484I

✅ Drop-In
Microchip Technology
📦 484-Ball FBGA (FG484)
600000 · 110592 · 172 · Fusion (Flash FPGA with optional ARM CoreMP7 support) · 130 nm, 7-layer metal, Flash-based CMOS · Nonvolatile Flash, retains program when powered off · Live at Power-Up (LAPU) · 1.5 V

✓ In Stock

$198 / Unit

View Datasheet →

M7AFS600-1FGG484I

✅ Drop-In
Microchip Technology
📦 484-Ball FBGA (FGG484)
Fusion (M7AFS600) · 600000 · 172 · 110592 · ARM CoreMP7 · 1.5 V · 1.425 V to 1.575 V · 1282.05 MHz

✓ In Stock

$228 / Unit

View Datasheet →

M7AFS600-2FGG484I

✅ Drop-In
Microchip Technology
📦 484-Ball FBGA (FGG484)
Fusion (M7 military/extended screening) · 600K · 172 · 1.5 V · 484-BGA (FBGA) · 1 mm · -2 · 1470.59 MHz

✓ In Stock

$243.75 / Unit

View Datasheet →

M7AFS600-FG484I Maximum Ratings & Electrical Characteristics

Family Fusion (Mixed-Signal FPGA)
System Gates 600K
Maximum Operating Frequency 1098.9 MHz
Embedded Flash (Configuration/System) 110592 bits
User I/O 172
Core Supply Voltage 1.5 V
Process Technology 130 nm
Processor Support ARM CoreMP7
Package 484-Ball FBGA (FG484)
Mounting Type Surface Mount
Configuration Type Flash-based (live at power-up)
Analog Peripherals Yes (mixed-signal front end)
Packaging Tray
Lifecycle Status Active (per Microchip/Microsemi product lines)

M7AFS600-FG484I 484-ball fbga (fg484) Pin Configuration Guide

Complete pinout information for M7AFS600-FG484I (484-ball fbga (fg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (fg484) package pinout diagram for M7AFS600-FG484I

No detailed pinout data available for M7AFS600-FG484I.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for M7AFS600-FG484I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

M7AFS600-FG484I is suitable for 6 applications: Industrial Control and Automation, Test and Measurement Instrumentation, Secure Embedded Systems, Motor Drive and Power Conversion Control, Mixed-Signal Bridging and Interface Conversion, Aerospace-Adjacent Prototyping and Avionics Ground Equipment.

🏭

Industrial Control and Automation

The M7AFS600-FG484I fits industrial control and factory automation because its 600K-gate Flash-based fabric, 172 user I/Os, and integrated mixed-signal front end allow PLC-style I/O scanning, motor sequencing, and sensor aggregation on one die, eliminating a separate ADC or CPLD. Its Flash configuration is live at power-up, so I/O is controlled within milliseconds of supply application - a safety benefit over SRAM FPGAs that sit idle during configuration. Industrial-temperature qualification supports panel and floor environments. Placed between field-side isolation and a host interface, the 1098.9 MHz fabric headroom comfortably handles deterministic scan engines, though the 1.5V core rail demands careful power sequencing in noisy cabinet installations.

🔬

Test and Measurement Instrumentation

Instrument makers choose the M7AFS600-FG484I because the Fusion architecture combines analog acquisition peripherals with 600K gates of programmable logic, letting trigger engines, time-stamping, and interface bridging share one die with analog front-end control. The 172 user I/Os on the 484-ball FBGA drive channel multiplexing, relay control, and backplane communication, while the 1098.9 MHz fabric ceiling supports fast counter/statistic blocks. Flash configuration avoids configuration PROMs on crowded instrument boards and resists bitstream tampering on exported test equipment. Designers should budget the 1.5V core supply noise budget carefully, since analog sections benefit from separate low-noise regulation and a solid ground reference plane.

🔒

Secure Embedded Systems

Flash-based FPGAs like the M7AFS600-FG484I are favored in secure embedded systems because the configuration bitstream lives in on-die Flash rather than an external PROM, removing a major attack surface for cloning or bitstream interception. The 600K-gate fabric can host AES-style crypto pipelines and the ARM CoreMP7 processor support enables embedded firmware in the same secure envelope. Live-at-power-up behavior lets tamper-monitor logic activate before user logic. With industrial temperature rating and tray packaging, the part suits defense-adjacent and critical-infrastructure controllers. The trade-off versus SRAM FPGAs is lower absolute fabric speed, so design crypto datapaths within the 1098.9 MHz family ceiling and verify timing in Libero.

Motor Drive and Power Conversion Control

In motor drives and power conversion, the M7AFS600-FG484I provides deterministic PWM generation across many channels using its 172 user I/Os and Flash fabric with microsecond-scale worst-case response, while the integrated mixed-signal front end reads current and voltage sense signals without a standalone ADC. The 600K gates host field-oriented control accelerators and protection interlocks that execute in fabric, independent of a soft-processor. Live-at-power-up configuration ensures gate outputs are defined immediately at board energization, simplifying safe-shutdown design. Place the FPGA between a host MCU and isolated gate drivers; the 1.5V core and I/O rails should follow the drive's power-good sequencing to avoid bus contention during brownouts.

🌐

Mixed-Signal Bridging and Interface Conversion

The M7AFS600-FG484I excels as a mixed-signal bridge: analog sensor inputs are digitized on-die by the Fusion front end while the 600K-gate fabric performs protocol conversion, FIFO buffering, and clock-domain crossing toward host interfaces. The 172 I/O count supports parallel legacy buses, SPI/I2C farms, and backplane signaling simultaneously, and the 1098.9 MHz ceiling gives timing margin for synchronous interfaces. Because configuration is Flash-based, the bridge comes up automatically at system power - important in hot-swap and always-on gateway roles. Designers should route analog and digital grounds carefully on the 484-ball FBGA footprint and validate signal integrity for the fastest I/O banks with controlled-impedance stackup.

✈️

Aerospace-Adjacent Prototyping and Avionics Ground Equipment

Programs that later fly Microchip RTAX radiation-hardened FPGAs commonly prototype on the commercial M7AFS600-FG484I, because the Fusion and antifuse toolchains share Libero and design constraints port with modest rework. The 600K gates approximate the capacity needed for attitude-control, telemetry, and bus-interface prototypes, while the 484-ball FBGA matches common ground-test board formats. Flash configuration means ground equipment powers up running without a loader host. Mixed-signal peripherals let one board test analog telemetry chains end to end. For flight conversion, expect to re-verify timing against the RTAX speed grade, since the 1098.9 MHz Fusion ceiling does not translate directly to antifuse fabric timing.

What is the M7AFS600-FG484I?
The M7AFS600-FG484I is a Microchip Technology (Microsemi) Fusion family mixed-signal FPGA with 600K system gates, 172 user I/Os, 110592 bits of embedded Flash, and a maximum operating frequency of 1098.9 MHz. It is built on 130nm Flash process technology, operates from a 1.5V core supply, and comes in a 484-ball FBGA (FG484) industrial-temperature (I suffix) package in tray packing. According to distributor listings at DigiKey and Jotrin, the device is categorized as a Fusion Field Programmable Gate Array IC.
What is the price of M7AFS600-FG484I?
M7AFS600-FG484I is priced in the ~$270-290 range for unit quantities, with the closely related commercial-temperature M7AFS600-FG484 listed from $273.98 at LCSC as of 2026-09-02. XAIPART tiers begin at $289.00 for qty 1 and scale down to $273.98 at qty 1000. Because this is a specialized mixed-signal FPGA with limited authorized distribution, prices vary significantly between brokers; always request a formal quote for volume orders and confirm pricing freshness before ordering.
Where can I buy M7AFS600-FG484I online?
You can buy M7AFS600-FG484I from XAIPART and from distributors including DigiKey, LCSC, Xecor, Hotenda, Jotrin, and Micro-Semiconductor.com, which listed 383 pcs in stock. Octopart aggregates pricing from 5 distributors for this part. Availability fluctuates because this Microsemi-era Fusion FPGA has limited authorized-channel production; verify date codes and authenticity when purchasing from independent distributors, and prefer authorized channels or franchised stock for production programs.
Is M7AFS600-FG484I in stock?
Stock exists in the independent distribution channel: Micro-Semiconductor.com reported 383 pcs of M7AFS600-FG484I in stock, and Octopart shows offers from 5 distributors as of the 2026-09-02 data snapshot. Authorized-channel stock at DigiKey may be limited or lead-time dependent for this Fusion family part. For production volumes, expect potential lead times and confirm exact lot date codes; XAIPART can quote available stock and lead time on request.
What is the difference between M7AFS600-FG484I and M7AFS600-FGG484I?
The difference lies in the ball/pad plating designation: FG484 denotes a standard FBGA package option while FGG484 denotes the lead-free (green) Pb-free ball variant in the same 484-ball footprint. Both are Microchip Fusion 600K-gate industrial FPGAs with 172 I/Os and identical logic resources, so board layout is the same. Per Xecor comparison data, M7AFS600-1FGG484I and FG484I variants differ mainly in speed grade and plating; always confirm the green-spec requirement of your program when choosing between the two.
M7AFS600-FG484I vs M7AFS600-1FG484I - which should I choose?
Choose M7AFS600-1FG484I when your design needs the higher speed grade: according to Xecor comparison data, the -1 speed grade is specified at up to 1.28205 GHz maximum operating frequency versus 1098.9 MHz for the base M7AFS600-FG484I, roughly a 17% timing advantage. Both share the same 484-ball FBGA package, 600K gates, 172 I/Os, and industrial temperature range. If your timing closure passes with the base grade, choose FG484I for lower cost; migrate to -1 only if static timing analysis fails at your target clock.
What is the best drop-in replacement for M7AFS600-FG484I?
The best drop-in replacements are same-family Microchip Fusion parts in the same 484-ball FBGA footprint: M7AFS600-FGG484I (green plating variant, pin-to-pin identical), M7AFS600-2FGG484I (slower speed grade, pin-to-pin), and M7AFS600-1FG484I (faster speed grade, pin-to-pin). No cross-brand pin-compatible substitute exists for the Flash-based mixed-signal Fusion architecture because the analog peripherals and Flash fabric are proprietary to Microsemi/Microchip. Verify your design timing constraints against the speed grade before swapping.
Can a Xilinx or Intel FPGA replace M7AFS600-FG484I?
No cross-brand FPGA can directly replace M7AFS600-FG484I in a drop-in manner. The Fusion family integrates Flash-based configuration and mixed-signal analog front ends that Xilinx (Artix/ Spartan) and Intel (Cyclone) devices do not replicate pin-to-pin, and the 484-ball ballout is proprietary. A migration to another vendor requires PCB redesign and fabric conversion. According to DigiKey's cross-reference tool, the closest alternatives are Microchip's own Fusion and SmartFusion family parts such as M2S060-FG484I, which must still be validated for pin compatibility.
Where can I download the M7AFS600-FG484I datasheet PDF?
Download the M7AFS600-FG484I datasheet PDF from the official Microchip Technology website product page or from distributor pages such as DigiKey, LCSC, and Hotenda, which all host free datasheet access. The authoritative document is the Microsemi Fusion Family of Mixed-Signal FPGAs datasheet available on microchip.com. Note that this page does not cite a specific datasheet document number or revision, because such identifiers were not present in the verified source data at the time of writing; always confirm the latest revision on the Microchip site.
Where can I find the M7AFS600-FG484I pinout?
The M7AFS600-FG484I pinout appears in the Fusion FPGA family datasheet published on the Microchip website, with a 484-ball FBGA ball map covering its 172 user I/Os plus power, ground, analog, and JTAG balls. Because a 484-ball map is too large to reproduce reliably on this page, we have not listed the ballout here; refer to the package/ballout section of the official Microchip Fusion datasheet for the authoritative table, and use Libero SoC design software, which includes package files for all Fusion devices.
What supply voltage does the M7AFS600-FG484I require?
The M7AFS600-FG484I requires a 1.5V core supply per its Jotrin and FPGAkey listings, along with I/O bank and auxiliary supply rails (typical of the Fusion family). Note that the exact number of separate voltage rails and their values for all I/O banks were not fully enumerated in the verified source data, so consult the official Microchip Fusion datasheet power-supply section for the complete rail list before finalizing your power tree and sequencing design.
Is the M7AFS600-FG484I suitable for industrial temperature environments?
Yes. The I suffix on M7AFS600-FG484I denotes the industrial temperature grade, which is the standard Fusion offering range starting at -40C on the low end. The exact upper industrial limit was not stated in the verified web data for this specific MPN, so confirm the -40C to +100C or +125C ceiling in the Microchip Fusion datasheet. The industrial grade suits factory automation, instrumentation, and outdoor equipment; commercial (C suffix) variants must not be used where ambient exceeds the commercial range.
Is M7AFS600-FG484I RoHS compliant?
The RoHS status of M7AFS600-FG484I could not be confirmed from the verified data and is therefore listed as unknown on this page. Microchip generally offers RoHS-compliant green variants of Fusion parts, and the related M7AFS600-FGG484I (GG = green) designation indicates the lead-free/green package option. For regulatory assurance on your BOM, pull the Material Declaration and certificate of conformance directly from the Microchip product page for the exact suffix you are purchasing.
What are the key specifications of M7AFS600-FG484I that engineers should know?
The key specifications are: 600K system gates of Flash-based FPGA fabric; 172 user I/Os; 110592 bits of embedded Flash; 1098.9 MHz maximum operating frequency; 130nm process technology; 1.5V core supply; ARM CoreMP7 processor support; mixed-signal analog peripherals; 484-ball FBGA package; industrial temperature grade; tray packaging. These come from DigiKey, Jotrin, and FPGAkey product listings. The Fusion family's defining trait is single-die integration of analog front end, Flash configuration, and digital logic for secure, live-at-power-up mixed-signal designs.
Hey Google, what can replace M7AFS600-FG484I?
Pin-compatible replacements for M7AFS600-FG484I are limited to Microchip's own Fusion 600K parts in the FG484/FGG484 package: M7AFS600-FGG484I (green variant), M7AFS600-2FGG484I (slower -2 grade), M7AFS600-1FG484I (faster -1 grade at 1.28205 GHz), and M7AFS600-1FGG484I. No other manufacturer makes a pin-compatible substitute because the Fusion mixed-signal architecture is proprietary. If a full redesign is acceptable, Microchip SmartFusion (e.g., M2S060-FG484I) offers a modern path, but it is not a drop-in swap.
What design tools are used to program the M7AFS600-FG484I?
The M7AFS600-FG484I is designed with Microchip/Microsemi Libero SoC design suite, which supports synthesis, place-and-route, timing analysis, and Flash programming for Fusion family devices. Libero provides device package files containing the authoritative 484-ball FBGA ball map and I/O constraints. Programming uses the Flash fabric, which retains configuration at power-up without an external PROM. For exact supported tool versions, check the Microchip Libero documentation, as the verified source data for this page did not specify a minimum software revision.

Engineering reference data for M7AFS600-FG484I — comparison, design guidance, and compliance information.

Selection Guide

Choose M7AFS600-FG484I when your design needs Flash-based, live-at-power-up mixed-signal FPGA capability - integrated analog front end plus 600K gates and 172 I/Os - in the standard industrial 484-ball FBGA, and your timing analysis closes below the 1098.9 MHz family ceiling. Select M7AFS600-1FG484I or 1FGG484I when static timing fails and you need the 1.28205 GHz -1 grade, accepting a price premium. Choose the FGG484I plating variants when RoHS/lead-free procurement mandates green packaging. Avoid M7AFS600-2FGG484I for timing-aggressive designs; it suits PWM-class or control logic where fabric speed is not limiting. Do not attempt cross-brand substitution: Xilinx/Intel devices share no ballout, and the proprietary analog front end has no equivalent - migration to SmartFusion2 (M2S060) requires PCB redesign. All listed Fusion alternatives reuse the same footprint, enabling layout reuse across speed grades.

Comparison with Alternatives

Parameter This Product M7AFS600-FGG484I M7AFS600-1FG484I M7AFS600-1FGG484I M7AFS600-2FGG484I
Package 484-Ball FBGA (FG484) 484-Ball FBGA (FGG484) - same footprint 484-Ball FBGA (FG484) - same footprint 484-Ball FBGA (FGG484) - same footprint 484-Ball FBGA (FGG484) - same footprint
Brand Microchip Technology (Microsemi) Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600K 600K 600K 600K 600K
Max Operating Frequency 1098.9 MHz 1098.9 MHz 1.28205 GHz 1.28205 GHz [DATA_NEEDED]
User I/O 172 172 172 172 172
Embedded Flash 110592 bits 110592 bits 110592 bits 110592 bits 110592 bits
Core Supply Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Speed Grade Standard Standard -1 (faster) -1 (faster) -2 (slower)
Lead-Free / Plating [DATA_NEEDED] Green (lead-free) [DATA_NEEDED] Green (lead-free) Green (lead-free)

Key Differentiators

  • Fastest standard-package speed in family for critical timing (vs M7AFS600-2FGG484I)
  • On-die mixed-signal front end (vs A3P600-1FG484I)
  • Flash configuration, live at power-up (vs M7AFS600-FGG484I)
  • Cost-optimized timing headroom available (vs M7AFS600-1FG484I)

Design Notes

Estimated: the Fusion family core runs at 1.5 V, and core current scales with toggle rate; at moderate fabric utilization (30-40%) on a 600K-gate die, expect core dissipation on the order of a few hundred milliwatts - derive the exact figure with Microchip's Fusion power calculator in Libero using your post-place-and-route netlist. Provide separate regulation for the 1.5V core and I/O bank rails, add 22-100 uF bulk plus 0.1 uF per power ball region, and enforce power-good-based sequencing between rails. Never share a noisy drive-logic supply with the analog front-end supply pins.

The 484-ball FBGA at 1.0 mm pitch requires a multilayer stackup - typically 8+ layers with dedicated ground plane and short, daisy-chained or star-routed power. Microvia-in-pad or via-in-pad epoxy-fill is recommended under the ball field to escape inner rows. Plan rework capability: BGA rework needs profiled hot-gas equipment and X-ray inspection for solder verification, so define testability (boundary scan via JTAG is available on Fusion devices) before layout freeze. Keep analog front-end traces short, guarded, and referenced to a clean ground region on the outer layers.

Do not confuse speed-grade and plating suffixes when ordering: FG484 vs FGG484 differ in plating (standard vs green/lead-free), and -1/-2 grades change timing closure results - a design that meets 1098.9 MHz-class constraints on the standard part may fail on M7AFS600-2FGG484I. Also remember the Fusion configuration is Flash-based and live at power-up: I/O pins drive per your design almost immediately, so external bus keep-alive or isolation may be needed if other devices power up later. Always re-run full static timing analysis in Libero when swapping any suffix.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, REACH and lead-free status were not stated in the verified source data for this exact MPN and are therefore marked unknown; the FGG484 green variants in the same family denote lead-free packaging. Obtain Microchip's official material declaration for regulatory certification.

Data verified on: 2026-09-02 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Microsemi Corporation M7AFS600-FG484I M7AFS600-FGG484I M7AFS600-1FG484I M7AFS600-1FGG484I M7AFS600-2FGG484I M2S060-FG484I A3P600-1FG484I Fusion family FPGA field-programmable gate array mixed-signal FPGA Flash-based configuration ARM CoreMP7 130nm process FBGA-484 ball grid array surface mount industrial temperature grade Libero SoC ProASIC3 RTAX SmartFusion2 1.5V core supply 1098.9 MHz
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