M7AFS600-2FGG256I vs A3PE600-FGG256I Comparison

Detailed side-by-side comparison of M7AFS600-2FGG256I by Microchip Technology and A3PE600-FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-2FGG256I M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip

M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip

M7AFS600-2FGG256I ✓ Active
Microchip Technology
A3PE600-FGG256I A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG256I ✓ Active

Specification Comparison

Parameter M7AFS600-2FGG256I A3PE600-FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $389.60 $41.80
Family Fusion Mixed-Signal FPGA (Actel/Microchip) ProASIC3E Flash FPGA
System Gates 600000 600000 gates
User I/O 119 165
Flash Memory Blocks 110592 bits —
Processor Support ARM CoreMP7 —
Process Technology 130 nm, 7-layer metal, flash-based CMOS CMOS flash FPGA
System Performance 350 MHz —
Supply Voltage 1.5 V (core) —
Logic Family CMOS —
Configuration Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) —
Package 256-LBGA (FBGA-256), 1.0 mm ball pitch 256-FBGA (S-PBGA-B256), 17 x 17 mm
Number of Pins/Balls 256 —
Operating Temperature 0 to 70 C -40C to +85C (Industrial)
Speed Grade -2 —
Mounting Type Surface Mount Surface Mount
Packaging Tray —
Logic Elements (VersaTiles) — 13824
Embedded Flash Memory — 110592 bits
Core Supply Voltage — 1.5 V
Maximum Internal Performance — 350 MHz
Ball Pitch — 1.0 mm
Package Height — 1.6 mm
Configuration Memory — On-chip Flash (non-volatile, single-chip)
RoHS Status — Compliant (lead free)
Footprint Compatibility — FG256 and FG484 footprint-compatible packages

Datasheets & Resources

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