M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
MPN: M7AFS600-2FGG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $448.5 | $448.50 |
| 10 | $431.2 | $4,312.00 |
| 100 | $416.85 | $41,685.00 |
| 500 | $402.3 | $201,150.00 |
| 1,000 | $389.6 | $389,600.00 |
Drop-in alternatives for M7AFS600-2FGG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-2FGG256
✅ Drop-In✓ In Stock
$274.05 / Unit
View Datasheet →M7AFS600-1FGG256I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →M7AFS600-FGG256I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →M7AFS600-1FG256I
✅ Drop-In✓ In Stock
$308.6 / Unit
View Datasheet →M7AFS600-2FG256
✅ Drop-In✓ In Stock
$135.1 / Unit
View Datasheet →M7AFS600-2FGG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600000 |
| User I/O | 119 |
| Flash Memory Blocks | 110592 bits |
| Processor Support | ARM CoreMP7 |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS |
| System Performance | 350 MHz |
| Supply Voltage | 1.5 V (core) |
| Logic Family | CMOS |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| Package | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Number of Pins/Balls | 256 |
| Operating Temperature | 0 to 70 C |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
| Packaging | Tray |
M7AFS600-2FGG256I 256-lbga (fbga-256), 1.0 mm ball pitch Pin Configuration Guide
Complete pinout information for M7AFS600-2FGG256I (256-lbga (fbga-256), 1.0 mm ball pitch package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-2FGG256I.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-2FGG256I is suitable for 6 applications: Industrial Automation and Motor Control, Power Supply Supervision and Telemetry, Aerospace and Defense Systems, Portable Instrumentation, Medical Diagnostic Equipment, Embedded Communication and Networking Nodes.
Industrial Automation and Motor Control
The M7AFS600-2FGG256I fits industrial control because its 600K system gates integrate sequencer, PWM, and communication logic while the ARM CoreMP7 soft processor handles protocol stacks. Fusion's integrated analog monitoring channels track motor current and voltage in real time without an external ADC supervisor, and the nonvolatile flash configuration means the controller is Live at Power-Up - no boot delay for safety-interlocked machinery. The industrial-grade I suffix supports harsh factory-floor temperatures. Placed as the single-chip control element, it removes a discrete microcontroller plus CPLD pair, saving board area; the trade-off is 1.5 V core rail sequencing care in noisy inverter environments.
Recommended
Power Supply Supervision and Telemetry
Fusion's defining feature is on-die programmable analog: voltage, temperature, and current monitoring gates that make the M7AFS600-2FGG256I a natural power-system supervisor. It can watch multiple rails with built-in comparators and thresholds, log faults into flash, and shut down systems via its 119 user I/O - all in one chip. Because configuration is nonvolatile with LAPU, supervision is active before an external microcontroller finishes booting, closing the classic cold-start protection gap. The 350 MHz fabric performance handles fast fault-response logic. Design consideration: analog channel accuracy depends on clean reference decoupling at the FBGA power balls.
Recommended
Aerospace and Defense Systems
Flash-based FPGAs are favored in aerospace because they are inherently single-chip, configuration-store-free, and resistant to configuration upsets compared with SRAM fabrics. The M7AFS600-2FGG256I's 600K gates handle glue logic, bus interfaces, and payload processing, while the ARM CoreMP7 hosts mission control software. Live-at-Power-Up operation suits time-critical avionics startup sequences, and the compact 256-ball FBGA (1.0 mm pitch) saves board area in conformally-cooled modules. Engineers should derate for radiation and temperature per program requirements and confirm screening levels, since standard commercial screening differs from MIL-flow parts.
Recommended
Portable Instrumentation
Battery-powered instruments benefit from the M7AFS600-2FGG256I's nonvolatile architecture: no configuration current or boot energy is spent at turn-on, and flash retains calibration data and firmware through power cycles. The integrated analog channels replace a discrete supervisory ADC, while 600K gates implement DSP pre-processing for sensor arrays. The 256-ball FBGA at 1.0 mm pitch fits dense handheld PCBs. A key advantage over SRAM FPGAs is the elimination of the configuration PROM's standby draw; the consideration is that the 1.5 V core plus I/O rails should be generated by high-efficiency step-down converters to maximize battery life.
Recommended
Medical Diagnostic Equipment
In medical devices such as bedside monitors and portable diagnostics, the M7AFS600-2FGG256I combines sensor-front-end logic, ARM CoreMP7 control, and on-die voltage/temperature supervision to meet single-chip reliability goals. Live-at-Power-Up configuration guarantees the device is functional the moment power appears - important for alarm-path integrity. Flash retention preserves patient calibration data across power events, and the mixed-signal fabric digitizes analog health parameters without an external converter for basic monitoring. Compliance-focused designs should verify the exact RoHS/material certificates for this suffix and follow the manufacturer's clinical-grade design guidance in the Fusion datasheet.
Recommended
Embedded Communication and Networking Nodes
The 350 MHz fabric performance and CoreMP7 processor let the M7AFS600-2FGG256I implement UART/SPI/I2C concentrates, industrial Ethernet pre-processing, and backplane glue logic in compact networked nodes. Nonvolatile configuration eliminates the boot-time window during which an SRAM FPGA is offline - valuable in redundant systems requiring instant failover. The 119 user I/O cover multi-bank mixed-voltage interfacing on a single 256-ball FBGA. Design consideration: implement clean I/O bank power islands at 1.0 mm pitch breakout, and use the on-die flash to store node addresses and configuration for field re-provisioning via the JTAG or programming interface.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-2FGG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-2FGG256 | M7AFS600-1FGG256I | M7AFS600-FGG256I | M7AFS600-1FG256I |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (FGG256), 1.0 mm pitch | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FG256) - same footprint, Pb-free ball |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | -2 (fastest) | -2 | -1 | Standard | -1 |
| Temperature Grade | Industrial (I suffix) | Commercial | Industrial | Industrial | Industrial |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Processor Support | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Configuration | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU |
Key Differentiators
- Fastest -2 speed grade in the FGG256 industrial family (vs M7AFS600-1FGG256I)
- Nonvolatile flash configuration with Live at Power-Up (vs SRAM FPGAs (e.g. Spartan-6 class))
- Industrial temperature qualification (vs M7AFS600-2FGG256)
- Single-chip mixed-signal integration (vs Any cross-brand FPGA)
Design Notes
The M7AFS600-2FGG256I core runs from 1.5 V; estimated rail sequencing should bring core and I/O supplies up per the Fusion datasheet power-up guidance to avoid latch-up during flash read at power-on. Because configuration is nonvolatile, no external PROM rail is needed, simplifying the power tree. Estimated: budget core current from the datasheet power calculator in Libero SoC using your actual toggle rates rather than worst-case family numbers, which can overestimate by 2x.
The 1.0 mm ball pitch FBGA-256 requires via-in-pad or dog-bone breakout; plan a 4+ layer stack with dedicated 1.5 V core and I/O bank planes. Place 0.1 uF ceramic decoupling capacitors within 2 mm of power balls, one per power pair, plus bulk 10 uF per rail. Fan out signal balls on 4-mil trace/4-mil space to escape the array without wasting layers.
Do not substitute across speed grades (-1 vs -2) without re-running static timing analysis in Libero SoC - the Fabric timing closure that passes at -2 may fail at -1. Also, analog monitoring channel accuracy on Fusion depends on reference decoupling; omitting the recommended reference capacitor network degrades voltage-monitor accuracy. Finally, confirm the temperature grade suffix matches your environment: the commercial-grade FG256 parts are not characterized for industrial extremes.
Compliance Information
RoHS/lead-free status for this exact suffix was not stated in the provided verified data; Microchip legacy FG vs FGG suffix conventions differ within the Fusion family. Obtain the material declaration from the Microchip product page or distributor compliance certificate.
