M7AFS600-2FGG256I vs A3PE600-FGG256I 对比
详细并排对比 M7AFS600-2FGG256I 出自 Microchip Technology 和 A3PE600-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ 量产中Microchip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ 量产中规格对比
| 参数 | M7AFS600-2FGG256I | A3PE600-FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $389.60 | $41.80 |
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) | ProASIC3E Flash FPGA |
| System Gates | 600000 | 600000 gates |
| User I/O | 119 | 165 |
| Flash Memory Blocks | 110592 bits | — |
| Processor Support | ARM CoreMP7 | — |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS | CMOS flash FPGA |
| System Performance | 350 MHz | — |
| 电源电压 | 1.5 V (core) | — |
| Logic Family | CMOS | — |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) | — |
| 封装 | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Number of Pins/Balls | 256 | — |
| 工作温度 | 0 to 70 C | -40C to +85C (Industrial) |
| Speed Grade | -2 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Configuration Memory | — | On-chip Flash (non-volatile, single-chip) |
| RoHS 状态 | — | Compliant (lead free) |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |