MC56F82726VLF vs MC56F8322MFAE Comparison
Detailed side-by-side comparison of MC56F82726VLF by NXP Semiconductors and MC56F8322MFAE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC56F82726VLF - 32-bit DSC, 100MHz, 32KB Flash, 48-LQFP | NXP
MC56F82726VLF ✓ ActiveSpecification Comparison
| Parameter | MC56F82726VLF | MC56F8322MFAE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.18 | $8.75 |
| Core | 56800EX 32-bit DSC | 56800E |
| Maximum CPU Frequency | 100 MHz | — |
| Program Flash | 32 KB (16K x 16) | — |
| RAM | 8 KB (4K x 16) | — |
| Package | 48-LQFP (VLF), 7x7 mm | 48-LQFP (7x7 mm) |
| Operating Voltage | 2.7 V to 3.6 V | — |
| I/O Voltage Tolerance | 5 V TTL-compatible (RESET is 3.3 V only) | — |
| ADC | Dual 12-bit, with sample-and-hold [DATA_NEEDED: number of ADC channels] | — |
| PWM Module | eFlexPWM, up to 6 channels [DATA_NEEDED: exact channel count per module] | — |
| Comparators | Yes, on-chip analog comparators for current protection | — |
| Quadrature Decoder | Yes | — |
| Communication | [DATA_NEEDED: list of SCI/SPI/I2C/CAN counts] | — |
| Operating Temperature | -40C to +105C (industrial, VLF suffix) | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | High-density low-power CMOS | — |
| Pin Count | 48 | — |
| Data Bus Width | — | 16 bit |
| Maximum Clock Frequency | — | 60 MHz |
| Sustained Throughput | — | 60 MIPS |
| Program Memory Size | — | 32 KB (16K x 16) Flash |
| Operating Supply Voltage | — | 2.5 V core / 3.3 V I/O |
| Operating Temperature Range | — | -40 C to +105 C (automotive grade) |
| Temperature Grade | — | Automotive |
| Number of I/Os | — | 21 |
| Communication Interfaces | — | CAN, SCI, SPI |
| Architecture | — | Harvard, 3 execution units, up to 6 ops/cycle |