MC56F82726VLF vs MC56F8322MFAE Vergleich
Detaillierter Direktvergleich von MC56F82726VLF von NXP Semiconductors und MC56F8322MFAE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC56F82726VLF - 32-bit DSC, 100MHz, 32KB Flash, 48-LQFP | NXP
MC56F82726VLF ✓ AktivSpezifikationsvergleich
| Parameter | MC56F82726VLF | MC56F8322MFAE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,18 | $8,75 |
| Core | 56800EX 32-bit DSC | 56800E |
| Maximum CPU Frequency | 100 MHz | — |
| Program Flash | 32 KB (16K x 16) | — |
| RAM | 8 KB (4K x 16) | — |
| Gehäuse | 48-LQFP (VLF), 7x7 mm | 48-LQFP (7x7 mm) |
| Operating Voltage | 2.7 V to 3.6 V | — |
| I/O Voltage Tolerance | 5 V TTL-compatible (RESET is 3.3 V only) | — |
| ADC | Dual 12-bit, with sample-and-hold [DATA_NEEDED: number of ADC channels] | — |
| PWM Module | eFlexPWM, up to 6 channels [DATA_NEEDED: exact channel count per module] | — |
| Comparators | Yes, on-chip analog comparators for current protection | — |
| Quadrature Decoder | Yes | — |
| Communication | [DATA_NEEDED: list of SCI/SPI/I2C/CAN counts] | — |
| Betriebstemperatur | -40C to +105C (industrial, VLF suffix) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | High-density low-power CMOS | — |
| Pin-Anzahl | 48 | — |
| Datenbusbreite | — | 16 bit |
| Maximale Taktfrequenz | — | 60 MHz |
| Sustained Throughput | — | 60 MIPS |
| Program Memory Size | — | 32 KB (16K x 16) Flash |
| Betriebsversorgungsspannung | — | 2.5 V core / 3.3 V I/O |
| Betriebstemperaturbereich | — | -40 C to +105 C (automotive grade) |
| Temperature Grade | — | Automotive |
| Number of I/Os | — | 21 |
| Communication Interfaces | — | CAN, SCI, SPI |
| Architecture | — | Harvard, 3 execution units, up to 6 ops/cycle |