MC68332ACFC16 vs MC68332ACFC25 Comparison
Detailed side-by-side comparison of MC68332ACFC16 by NXP Semiconductors and MC68332ACFC25 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC68332ACFC16 - 32-Bit Modular MCU 16MHz ROMless 132-PQFP | NXP
MC68332ACFC16 ObsoleteNXP Semiconductors
MC68332ACFC25 - 32-Bit 25MHz CPU32 MCU ROMless 132-PQFP | NXP
MC68332ACFC25 ObsoleteSpecification Comparison
| Parameter | MC68332ACFC16 | MC68332ACFC25 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.95 | $18.95 |
| Core Architecture | CPU32 (M68000 family) | — |
| Data Bus Width | 32-bit | — |
| Address Bus Width | 24-bit | — |
| Maximum Clock Frequency | 16.78 MHz | — |
| On-chip RAM | 2 KB | — |
| Program Memory Type | ROMless (external memory interface) | ROMless |
| Package | 132-PQFP (Bumpered QFP) 24.13 x 24.13 mm | — |
| Number of I/O Lines | 15 (dedicated) + multiplexed peripheral I/O | — |
| Number of External Interrupts | 7 | — |
| Number of Serial I/Os | 3 (QSM: 1 SCI + 1 SPI + 1 QSPI sub-module) | — |
| Operating Supply Voltage | 5 V | — |
| Operating Temperature Range | -40 C to +85 C (industrial) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Peripheral Modules | TPU, QSM, SIM, CTM4 | — |
| MSL Level | [DATA_NEEDED: MSL Level] | [DATA_NEEDED: MSL level] |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| Core | — | CPU32 (32-bit) |
| Operating Frequency | — | 25 MHz |
| RAM Size | — | 2K x 8 (2 KB) |
| Number of I/O | — | 15 |
| Package / Case | — | 132-BQFP Bumpered (PQFP-132, 24.13x24.13 mm) |
| Oscillator Type | — | Internal |
| Supply Voltage Range | — | 4.5 V to 5.5 V (typical 5 V operation) [DATA_NEEDED: exact min/max] |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Integrated Modules | — | CPU32 + SIM + TPU + QSM |
| Intermodule Bus | — | 16-bit IMB |
| External Data Bus | — | 16-bit |
| External Address Bus | — | 24-bit |