MC9S08AC60CFDE vs MC9S08AC32CFDE Comparison

Detailed side-by-side comparison of MC9S08AC60CFDE by NXP Semiconductors and MC9S08AC32CFDE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08AC60CFDE MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE Nrnd

Specification Comparison

Parameter MC9S08AC60CFDE MC9S08AC32CFDE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $8.60 $3.02
Core Processor S08 (HCS08), 8-bit CISC —
Core Size 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
Supply Voltage Range 2.7 V to 5.5 V —
Operating Supply Voltage 3.3 V / 5 V —
Number of I/O 38 —
ADC Resolution 10-bit —
ADC Channels Up to 16-channel with automatic compare function —
Communication Interfaces 2x SCI (LIN 2.0, SAE J2602), SPI, IIC SCI (UART) and SPI
Peripherals ADC, SCI, SPI, IIC —
Package 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad 48-QFN-EP (7x7 mm) with exposed thermal pad
Mounting Type Surface Mount Surface Mount
Family Compatibility Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) —
Lifecycle Status NRND (per NXP product page) NRND (Not Recommended for New Designs, per NXP product page)
RoHS Status ROHS COMPLIANT (per distributor datasheet listing) —
Packaging Tray —
Operating Temperature Range [DATA_NEEDED: operating temperature range] -40 C to +125 C (automotive grade)
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Core Architecture — S08 (HCS08 family, 8-bit CISC)
Program Memory (Flash) — 32 KB
RAM — 1 KB
Maximum CPU Frequency — 40 MHz
Supply Voltage (VDD) — 2.7 V to 5.5 V
Number of I/O Pins — 38
ADC — 8-channel, 10-bit
Timers — 16-bit timer/PWM, plus additional 8-bit and 2-channel modules
Debug Interface — Single-wire BDM (Background Debug Mode)
Internal Clock Source — Yes (ICS - Internal Clock Source)
Temperature Grade — Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter]
Data Bus Width — 8-bit
MSL (Moisture Sensitivity Level) — MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life]
RoHS Compliance — Compliant (per NXP product page)
Lead-Free — Yes (per distributor packaging datasheet)

Datasheets & Resources

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