MC9S08AC60CFDE vs MC9S08AC32CFDE Comparación
Comparación detallada lado a lado de MC9S08AC60CFDE por NXP Semiconductors y MC9S08AC32CFDE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparación de especificaciones
| Parámetro | MC9S08AC60CFDE | MC9S08AC32CFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,60 | $3,02 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Tensión de alimentación de funcionamiento | 3.3 V / 5 V | — |
| Number of I/O | 38 | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | Up to 16-channel with automatic compare function | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | SCI (UART) and SPI |
| Peripherals | ADC, SCI, SPI, IIC | — |
| Encapsulado | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) | — |
| Estado del ciclo de vida | NRND (per NXP product page) | NRND (Not Recommended for New Designs, per NXP product page) |
| Estado RoHS | ROHS COMPLIANT (per distributor datasheet listing) | — |
| Packaging | Tray | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C (automotive grade) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Ancho del bus de datos | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |