MC9S08AC60CFDE vs MC9S08AC32CFDE Comparaison
Comparaison détaillée côte à côte de MC9S08AC60CFDE par NXP Semiconductors et MC9S08AC32CFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparaison des spécifications
| Paramètre | MC9S08AC60CFDE | MC9S08AC32CFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8,60 | $3,02 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Tension d'alimentation de fonctionnement | 3.3 V / 5 V | — |
| Number of I/O | 38 | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | Up to 16-channel with automatic compare function | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | SCI (UART) and SPI |
| Peripherals | ADC, SCI, SPI, IIC | — |
| Boîtier | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Type de montage | Surface Mount | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) | — |
| Statut du cycle de vie | NRND (per NXP product page) | NRND (Not Recommended for New Designs, per NXP product page) |
| Statut RoHS | ROHS COMPLIANT (per distributor datasheet listing) | — |
| Packaging | Tray | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40 C to +125 C (automotive grade) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largeur du bus de données | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |