MC9S08AW60CPUE vs MC9S08AW48CPUE Comparison
Detailed side-by-side comparison of MC9S08AW60CPUE by NXP Semiconductors and MC9S08AW48CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW60CPUE | MC9S08AW48CPUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | 4 KB | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | — |
| ADC | 10-bit | — |
| Instruction Set | HC08 (CISC) with added BGND instruction | HC08 with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Package | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | — |
| CPU Speed | — | 40 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 48 KB (48K x 8) |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |