MC9S08AW60CPUE vs MC9S08AW48CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW60CPUE von NXP Semiconductors und MC9S08AW48CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CPUE | MC9S08AW48CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | 4 KB | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | — |
| ADC | 10-bit | — |
| Instruction Set | HC08 (CISC) with added BGND instruction | HC08 with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | — |
| CPU Speed | — | 40 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 48 KB (48K x 8) |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |