MC9S08AW60MPUE557 vs MC9S08AW48CPUE Comparison

Detailed side-by-side comparison of MC9S08AW60MPUE557 by NXP Semiconductors and MC9S08AW48CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08AW60MPUE557 MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 ✓ Active
NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd

Specification Comparison

Parameter MC9S08AW60MPUE557 MC9S08AW48CPUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $6.10 $0.00
Core Architecture HCS08 (enhanced S08) —
Data Bus Width 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
Operating Supply Voltage 2.7 V to 5.5 V —
I/O Pins 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa —
Package 64-LQFP (10x10 mm) —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
ADC [DATA_NEEDED: number of channels and resolution] —
PWM Channels [DATA_NEEDED: PWM channel count] —
Serial Interfaces SCI, SPI, I2C (per NXP family description) —
Debug Interface Single-wire Background Debug Mode (BDM) Single-wire background debug mode (BDM)
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
CPU Speed — 40 MHz
Program Memory Type — FLASH
Program Memory Size — 48 KB (48K x 8)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Package Type — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2)
Package Height — 1 mm
Instruction Set — HC08 with added BGND instruction
Packaging — Tray
Lifecycle Status — NRND (Not Recommended for New Designs)

Datasheets & Resources

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