MC9S08AW60MPUE557 vs MC9S08AW48CPUE Vergleich

Detaillierter Direktvergleich von MC9S08AW60MPUE557 von NXP Semiconductors und MC9S08AW48CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AW60MPUE557 MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 ✓ Aktiv
NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd

Spezifikationsvergleich

Parameter MC9S08AW60MPUE557 MC9S08AW48CPUE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,10 $0,00
Core Architecture HCS08 (enhanced S08) —
Datenbusbreite 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
Betriebsversorgungsspannung 2.7 V to 5.5 V —
I/O Pins 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa —
Gehäuse 64-LQFP (10x10 mm) —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
ADC [DATA_NEEDED: number of channels and resolution] —
PWM Channels [DATA_NEEDED: PWM channel count] —
Serial Interfaces SCI, SPI, I2C (per NXP family description) —
Debug Interface Single-wire Background Debug Mode (BDM) Single-wire background debug mode (BDM)
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
CPU Speed — 40 MHz
Program Memory Type — FLASH
Program Memory Size — 48 KB (48K x 8)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Package Type — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2)
Package Height — 1 mm
Instruction Set — HC08 with added BGND instruction
Packaging — Tray
Lebenszyklusstatus — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

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