MC9S08DN32ACLC vs MC9S08DN60ACLC Comparison
Detailed side-by-side comparison of MC9S08DN32ACLC by NXP Semiconductors and MC9S08DN60ACLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteNXP Semiconductors
MC9S08DN60ACLC - 8-bit HCS08 MCU, 60KB Flash, USB, 32-LQFP | NXP
MC9S08DN60ACLC ✓ ActiveSpecification Comparison
| Parameter | MC9S08DN32ACLC | MC9S08DN60ACLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.35 | $4.05 |
| Series | S08DN | — |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz (20 MHz bus) | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| RAM Size | 2 KB | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of Interrupt Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND | — |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +85C | -40 C to +85 C |
| Part Status | Obsolete | — |
| Core | — | HCS08 (enhanced 8-bit) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 2 KB (2K x 8) |
| USB Controller | — | USB 2.0 full-speed device with on-chip transceiver |
| On-chip Voltage Regulator | — | 3.3 V, up to 100 mA for external load |
| CAN | — | Not present (NO CAN variant) |
| ADC | — | 10-bit |
| Timers | — | TPM (Timer/PWM), Real-Time Counter |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Oscillator | — | External crystal/oscillator |
| Packaging (shipping) | — | Tray |
| MSL Level | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| RoHS Status | — | Compliant |