MC9S08DN32ACLC vs MC9S08DN60ACLC Comparación
Comparación detallada lado a lado de MC9S08DN32ACLC por NXP Semiconductors y MC9S08DN60ACLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteNXP Semiconductors
MC9S08DN60ACLC - 8-bit HCS08 MCU, 60KB Flash, USB, 32-LQFP | NXP
MC9S08DN60ACLC ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08DN32ACLC | MC9S08DN60ACLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,35 | $4,05 |
| Series | S08DN | — |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz (20 MHz bus) | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| RAM Size | 2 KB | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of Interrupt Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND | — |
| Tensión de alimentación | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Encapsulado | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C | -40 C to +85 C |
| Part Status | Obsolete | — |
| Core | — | HCS08 (enhanced 8-bit) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 2 KB (2K x 8) |
| USB Controller | — | USB 2.0 full-speed device with on-chip transceiver |
| On-chip Voltage Regulator | — | 3.3 V, up to 100 mA for external load |
| CAN | — | Not present (NO CAN variant) |
| ADC | — | 10-bit |
| Timers | — | TPM (Timer/PWM), Real-Time Counter |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Oscillator | — | External crystal/oscillator |
| Packaging (shipping) | — | Tray |
| Nivel MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Estado RoHS | — | Compliant |