MC9S08DN32ACLC vs MC9S08DN60ACLC Comparaison
Comparaison détaillée côte à côte de MC9S08DN32ACLC par NXP Semiconductors et MC9S08DN60ACLC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteNXP Semiconductors
MC9S08DN60ACLC - 8-bit HCS08 MCU, 60KB Flash, USB, 32-LQFP | NXP
MC9S08DN60ACLC ✓ ActifComparaison des spécifications
| Paramètre | MC9S08DN32ACLC | MC9S08DN60ACLC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,35 | $4,05 |
| Series | S08DN | — |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz (20 MHz bus) | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| RAM Size | 2 KB | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of Interrupt Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND | — |
| Tension d'alimentation | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Boîtier | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +85C | -40 C to +85 C |
| Part Status | Obsolete | — |
| Core | — | HCS08 (enhanced 8-bit) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 2 KB (2K x 8) |
| USB Controller | — | USB 2.0 full-speed device with on-chip transceiver |
| On-chip Voltage Regulator | — | 3.3 V, up to 100 mA for external load |
| CAN | — | Not present (NO CAN variant) |
| ADC | — | 10-bit |
| Timers | — | TPM (Timer/PWM), Real-Time Counter |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Oscillator | — | External crystal/oscillator |
| Packaging (shipping) | — | Tray |
| Niveau MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Statut RoHS | — | Compliant |