MC9S08DN32AMLC vs MC9S08DN32ACLC Comparison

Detailed side-by-side comparison of MC9S08DN32AMLC by NXP Semiconductors and MC9S08DN32ACLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DN32ACLC MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC Obsolete

Specification Comparison

Parameter MC9S08DN32AMLC MC9S08DN32ACLC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $3.98 $4.35
Core HCS08 (S08) —
Instruction Set HC08 with BGND HC08 with added BGND
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) —
EEPROM Embedded —
Number of I/O 25 25
ADC 12-bit, up to 16 channels, 2.5 us conversion —
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm)
Operating Temperature -40 C to +125 C -40C to +85C
Supply Voltage [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
Mounting Type Surface Mount Surface Mount
Packaging Tray —
RoHS Status Compliant —
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) —
Series — S08DN
Core Processor — S08 (HCS08)
Core Size — 8-Bit
CPU Speed — 40 MHz (20 MHz bus)
Program Memory Size — 32 KB (32K x 8)
Program Memory Type — FLASH
EEPROM Size — 1 KB (1K x 8)
RAM Size — 2 KB
Connectivity — I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of Interrupt Sources — Up to 32
Part Status — Obsolete

Datasheets & Resources

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