MC9S08DN32AMLC vs MC9S08DZ128CLF Comparison

Detailed side-by-side comparison of MC9S08DN32AMLC by NXP Semiconductors and MC9S08DZ128CLF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DZ128CLF MC9S08DZ128CLF - 8-bit 40MHz S08 MCU, 128KB Flash, CAN | NXP

MC9S08DZ128CLF - 8-bit 40MHz S08 MCU, 128KB Flash, CAN | NXP

MC9S08DZ128CLF Nrnd

Specification Comparison

Parameter MC9S08DN32AMLC MC9S08DZ128CLF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $3.98 $3.92
Core HCS08 (S08) HCS08 (8-bit)
Instruction Set HC08 with BGND —
CPU Frequency 40 MHz 40 MHz
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) 8 KB
EEPROM Embedded 2 KB
Number of I/O 25 —
ADC 12-bit, up to 16 channels, 2.5 us conversion 12-bit, 24-channel, 2.5 us conversion
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
Package 32-LQFP (7x7 mm) 48-LQFP (7x7 mm), 0.5 mm pitch
Operating Temperature -40 C to +125 C -40C to +85C (industrial)
Supply Voltage [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
Mounting Type Surface Mount Surface Mount
Packaging Tray —
RoHS Status Compliant Compliant
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) On-chip BDM (single-wire background debug)
Bus Speed — 20 MHz
Flash Memory — 128 KB (128K x 8)
I/O Pins — 40
CAN — MSCAN (CAN 2.0A/B), 1 module
Communication Interfaces — 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN
Timers/PWM — 6-channel PWM timer module
MSL Level — 3 (per JEDEC J-STD-020)

Datasheets & Resources

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