MC9S08DN32AMLC vs MC9S08DZ128CLF Comparación
Comparación detallada lado a lado de MC9S08DN32AMLC por NXP Semiconductors y MC9S08DZ128CLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN32AMLC | MC9S08DZ128CLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,98 | $3,92 |
| Core | HCS08 (S08) | HCS08 (8-bit) |
| Instruction Set | HC08 with BGND | — |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | 8 KB |
| EEPROM | Embedded | 2 KB |
| Number of I/O | 25 | — |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | 12-bit, 24-channel, 2.5 us conversion |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Encapsulado | 32-LQFP (7x7 mm) | 48-LQFP (7x7 mm), 0.5 mm pitch |
| Temperatura de funcionamiento | -40 C to +125 C | -40C to +85C (industrial) |
| Tensión de alimentación | [DATA_NEEDED: VDD range] | 2.7 V to 5.5 V |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Estado RoHS | Compliant | Compliant |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | On-chip BDM (single-wire background debug) |
| Bus Speed | — | 20 MHz |
| Flash Memory | — | 128 KB (128K x 8) |
| I/O Pins | — | 40 |
| CAN | — | MSCAN (CAN 2.0A/B), 1 module |
| Communication Interfaces | — | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN |
| Timers/PWM | — | 6-channel PWM timer module |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |