MC9S08DN32AMLC vs MC9S08DZ32AMLH Comparison
Detailed side-by-side comparison of MC9S08DN32AMLC by NXP Semiconductors and MC9S08DZ32AMLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08DN32AMLC | MC9S08DZ32AMLH |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.98 | $0.00 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | HC08 with added BGND instruction (CISC) |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | Embedded EEPROM |
| Number of I/O | 25 | — |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | — |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Package | 32-LQFP (7x7 mm) | 64-LQFP (10x10 mm) |
| Operating Temperature | -40 C to +125 C | — |
| Supply Voltage | [DATA_NEEDED: VDD range] | 3.3V / 5V |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| RoHS Status | Compliant | — |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | On-chip emulation/debug (background debug, BGND) |
| Core Processor | — | HCS08 (S08 core) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz |
| Program Memory Size | — | 32KB (32K x 8) FLASH |
| ADC Resolution | — | 12 bit |
| ADC Channels | — | 24-channel |
| ADC Conversion Time | — | 2.5 us |
| CAN Module | — | Yes (embedded CAN, MSCAN) |
| Interrupt/Reset Sources | — | Up to 32 |
| Series | — | S08DZ (S08 Family, S08D Series) |
| Product Category | — | Microcontrollers (MCU) |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |