MC9S08DN32AMLC vs MC9S08DZ32AMLH Vergleich
Detaillierter Direktvergleich von MC9S08DN32AMLC von NXP Semiconductors und MC9S08DZ32AMLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN32AMLC | MC9S08DZ32AMLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,98 | $0,00 |
| Core | HCS08 (S08) | — |
| Instruction Set | HC08 with BGND | HC08 with added BGND instruction (CISC) |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 1.5 KB (1.5K x 8) | — |
| EEPROM | Embedded | Embedded EEPROM |
| Number of I/O | 25 | — |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion | — |
| CAN (MSCAN) | CAN 2.0 A/B | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Gehäuse | 32-LQFP (7x7 mm) | 64-LQFP (10x10 mm) |
| Betriebstemperatur | -40 C to +125 C | — |
| Versorgungsspannung | [DATA_NEEDED: VDD range] | 3.3V / 5V |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| RoHS-Status | Compliant | — |
| Oscillator Type | External | — |
| Debug Interface | Background Debug Mode (BDM) | On-chip emulation/debug (background debug, BGND) |
| Core Processor | — | HCS08 (S08 core) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz |
| Program Memory Size | — | 32KB (32K x 8) FLASH |
| ADC Resolution | — | 12 bit |
| ADC Channels | — | 24-channel |
| ADC Conversion Time | — | 2.5 us |
| CAN Module | — | Yes (embedded CAN, MSCAN) |
| Interrupt/Reset Sources | — | Up to 32 |
| Series | — | S08DZ (S08 Family, S08D Series) |
| Product Category | — | Microcontrollers (MCU) |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |