MC9S08DN32AMLC vs MC9S08DZ32AMLH 对比

详细并排对比 MC9S08DN32AMLC 出自 NXP Semiconductors 和 MC9S08DZ32AMLH 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08DZ32AMLH MC9S08DZ32AMLH - 8-bit S08 MCU 32KB Flash CAN 40MHz | NXP

MC9S08DZ32AMLH - 8-bit S08 MCU 32KB Flash CAN 40MHz | NXP

MC9S08DZ32AMLH Nrnd

规格对比

参数 MC9S08DN32AMLC MC9S08DZ32AMLH
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $3.98 $0.00
Core HCS08 (S08) —
Instruction Set HC08 with BGND HC08 with added BGND instruction (CISC)
CPU Frequency 40 MHz —
Bus Frequency 20 MHz 20 MHz
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) —
EEPROM Embedded Embedded EEPROM
Number of I/O 25 —
ADC 12-bit, up to 16 channels, 2.5 us conversion —
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
封装 32-LQFP (7x7 mm) 64-LQFP (10x10 mm)
工作温度 -40 C to +125 C —
电源电压 [DATA_NEEDED: VDD range] 3.3V / 5V
安装类型 Surface Mount Surface Mount
Packaging Tray Tray
RoHS 状态 Compliant —
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) On-chip emulation/debug (background debug, BGND)
Core Processor — HCS08 (S08 core)
Core Size — 8-Bit
Maximum CPU Frequency — 40 MHz
Program Memory Size — 32KB (32K x 8) FLASH
ADC Resolution — 12 bit
ADC Channels — 24-channel
ADC Conversion Time — 2.5 us
CAN Module — Yes (embedded CAN, MSCAN)
Interrupt/Reset Sources — Up to 32
Series — S08DZ (S08 Family, S08D Series)
Product Category — Microcontrollers (MCU)
生命周期状态 — NRND (Not Recommended for New Designs)

数据手册与资源

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