MC9S08DN60AMLH vs MC9S08DN60ACLH Comparison
Detailed side-by-side comparison of MC9S08DN60AMLH by NXP Semiconductors and MC9S08DN60ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08DN60AMLH | MC9S08DN60ACLH |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.58 | $5.21 |
| Product Type | 8-bit microcontroller | — |
| CPU Core | Enhanced HCS08 core | — |
| Maximum CPU Frequency | 40 MHz | — |
| System Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB | — |
| Flash Organization | 60K x 8 bits | — |
| RAM | 2 KB | — |
| ADC | 10-bit | 16-channel, 12-bit, 2.5 us conversion |
| Serial Interface | Multiple serial interfaces | — |
| LIN Capability | LIN master | — |
| LCD Support | LCD driver | — |
| Package | 64-LQFP, 10 x 10 mm | — |
| Mounting Type | Surface mount | Surface Mount |
| Embedded Emulation and Debug | Supported by HCS08 family documentation | — |
| Instruction Set | HCS08 instruction set | HC08 + BGND instruction |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Core | — | HCS08 (S08 core) |
| Data Bus Width | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM Size | — | 2 KB (2K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Package / Case | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| On-Chip Debug | — | BDM (Background Debug Mode) |