MC9S08DN60AMLH vs MC9S08DN60ACLH Comparación
Comparación detallada lado a lado de MC9S08DN60AMLH por NXP Semiconductors y MC9S08DN60ACLH por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN60AMLH | MC9S08DN60ACLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,58 | $5,21 |
| Product Type | 8-bit microcontroller | — |
| CPU Core | Enhanced HCS08 core | — |
| Maximum CPU Frequency | 40 MHz | — |
| System Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB | — |
| Flash Organization | 60K x 8 bits | — |
| RAM | 2 KB | — |
| ADC | 10-bit | 16-channel, 12-bit, 2.5 us conversion |
| Serial Interface | Multiple serial interfaces | — |
| LIN Capability | LIN master | — |
| LCD Support | LCD driver | — |
| Encapsulado | 64-LQFP, 10 x 10 mm | — |
| Tipo de montaje | Surface mount | Surface Mount |
| Embedded Emulation and Debug | Supported by HCS08 family documentation | — |
| Instruction Set | HCS08 instruction set | HC08 + BGND instruction |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Core | — | HCS08 (S08 core) |
| Ancho del bus de datos | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM Size | — | 2 KB (2K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Number of I/O | — | 53 |
| Encapsulado / Carcasa | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| On-Chip Debug | — | BDM (Background Debug Mode) |