MC9S08DV60AMLF vs MC9S08DN32AMLC Comparison
Detailed side-by-side comparison of MC9S08DV60AMLF by NXP Semiconductors and MC9S08DN32AMLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MC9S08DV60AMLF ✓ Active
Specification Comparison
| Parameter | MC9S08DV60AMLF | MC9S08DN32AMLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.60 | $3.98 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | 25 |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | 12-bit, up to 16 channels, 2.5 us conversion |
| Timers | Multiple TPM (per datasheet family) | — |
| Package | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +125C | -40 C to +125 C |
| RoHS Status | ROHS3 Compliant | Compliant |
| Debug Interface | Single-wire BDM | Background Debug Mode (BDM) |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Supply Voltage | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| Oscillator Type | — | External |