MC9S08DV60AMLF vs MC9S08DN32AMLC Vergleich
Detaillierter Direktvergleich von MC9S08DV60AMLF von NXP Semiconductors und MC9S08DN32AMLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DV60AMLF | MC9S08DN32AMLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,60 | $3,98 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | 25 |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | 12-bit, up to 16 channels, 2.5 us conversion |
| Timers | Multiple TPM (per datasheet family) | — |
| Gehäuse | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +125C | -40 C to +125 C |
| RoHS-Status | ROHS3 Compliant | Compliant |
| Debug Interface | Single-wire BDM | Background Debug Mode (BDM) |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Versorgungsspannung | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| Oscillator Type | — | External |