MC9S08DV60AMLF vs MC9S08DN32AMLC 对比
详细并排对比 MC9S08DV60AMLF 出自 NXP Semiconductors 和 MC9S08DN32AMLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08DV60AMLF | MC9S08DN32AMLC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4.60 | $3.98 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | 25 |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | 12-bit, up to 16 channels, 2.5 us conversion |
| Timers | Multiple TPM (per datasheet family) | — |
| 封装 | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C | -40 C to +125 C |
| RoHS 状态 | ROHS3 Compliant | Compliant |
| Debug Interface | Single-wire BDM | Background Debug Mode (BDM) |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| 电源电压 | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| Oscillator Type | — | External |