MC9S08DV60AMLF vs MC9S08DZ60AMLF Comparison
Detailed side-by-side comparison of MC9S08DV60AMLF by NXP Semiconductors and MC9S08DZ60AMLF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MC9S08DV60AMLF ✓ ActiveSpecification Comparison
| Parameter | MC9S08DV60AMLF | MC9S08DZ60AMLF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.60 | $0.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | 60 KB (60K x 8) Flash |
| RAM Size | 3 KB | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| RoHS Status | ROHS3 Compliant | RoHS compliant (per distributor listing) |
| Debug Interface | Single-wire BDM | — |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Supply Voltage | — | 3.3 V / 5 V |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Packaging | — | Tray |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) per NXP |