MC9S08DV60AMLF vs MC9S08DZ60AMLF Comparação
Comparação detalhada lado a lado de MC9S08DV60AMLF por NXP Semiconductors e MC9S08DZ60AMLF por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DV60AMLF | MC9S08DZ60AMLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,60 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | 60 KB (60K x 8) Flash |
| RAM Size | 3 KB | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Encapsulamento | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Status RoHS | ROHS3 Compliant | RoHS compliant (per distributor listing) |
| Debug Interface | Single-wire BDM | — |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Tensão de alimentação | — | 3.3 V / 5 V |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Packaging | — | Tray |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) per NXP |