MC9S08DV60AMLF vs MC9S08DZ60AMLF Comparaison
Comparaison détaillée côte à côte de MC9S08DV60AMLF par NXP Semiconductors et MC9S08DZ60AMLF par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DV60AMLF | MC9S08DZ60AMLF |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,60 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | 60 KB (60K x 8) Flash |
| RAM Size | 3 KB | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Boîtier | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | ROHS3 Compliant | RoHS compliant (per distributor listing) |
| Debug Interface | Single-wire BDM | — |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Tension d'alimentation | — | 3.3 V / 5 V |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Packaging | — | Tray |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs) per NXP |