MC9S08DZ32AMLH vs MC9S08DN32AMLC Comparison
Detailed side-by-side comparison of MC9S08DZ32AMLH by NXP Semiconductors and MC9S08DN32AMLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08DZ32AMLH | MC9S08DN32AMLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $3.98 |
| Core Processor | HCS08 (S08 core) | — |
| Core Size | 8-Bit | — |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with BGND |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| Supply Voltage | 3.3V / 5V | [DATA_NEEDED: VDD range] |
| ADC Resolution | 12 bit | — |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | Embedded |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Background Debug Mode (BDM) |
| Package | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Lifecycle Status | NRND (Not Recommended for New Designs) | — |
| Core | — | HCS08 (S08) |
| CPU Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| Number of I/O | — | 25 |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Operating Temperature | — | -40 C to +125 C |
| RoHS Status | — | Compliant |
| Oscillator Type | — | External |