MC9S08DZ32AMLH vs MC9S08DN32AMLC Vergleich
Detaillierter Direktvergleich von MC9S08DZ32AMLH von NXP Semiconductors und MC9S08DN32AMLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ32AMLH | MC9S08DN32AMLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $3,98 |
| Core Processor | HCS08 (S08 core) | — |
| Core Size | 8-Bit | — |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with BGND |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| Versorgungsspannung | 3.3V / 5V | [DATA_NEEDED: VDD range] |
| ADC Resolution | 12 bit | — |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | Embedded |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Background Debug Mode (BDM) |
| Gehäuse | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| Core | — | HCS08 (S08) |
| CPU Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| Number of I/O | — | 25 |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Betriebstemperatur | — | -40 C to +125 C |
| RoHS-Status | — | Compliant |
| Oscillator Type | — | External |