MC9S08DZ32AMLH vs MC9S08DN32AMLC 对比
详细并排对比 MC9S08DZ32AMLH 出自 NXP Semiconductors 和 MC9S08DN32AMLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08DZ32AMLH | MC9S08DN32AMLC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $3.98 |
| Core Processor | HCS08 (S08 core) | — |
| Core Size | 8-Bit | — |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with BGND |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| 电源电压 | 3.3V / 5V | [DATA_NEEDED: VDD range] |
| ADC Resolution | 12 bit | — |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | Embedded |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Background Debug Mode (BDM) |
| 封装 | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| Core | — | HCS08 (S08) |
| CPU Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| Number of I/O | — | 25 |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| 工作温度 | — | -40 C to +125 C |
| RoHS 状态 | — | Compliant |
| Oscillator Type | — | External |