MC9S08DZ60AMLF vs MC9S08DZ60ACLF Comparison
Detailed side-by-side comparison of MC9S08DZ60AMLF by NXP Semiconductors and MC9S08DZ60ACLF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndSpecification Comparison
| Parameter | MC9S08DZ60AMLF | MC9S08DZ60ACLF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $6.85 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 4 KB | — |
| Data EEPROM | Embedded EEPROM | — |
| Connectivity | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 24-channel (16-channel 12-bit ADC per FindIC overview) | — |
| ADC Conversion Time | 2.5 us | — |
| Analog Comparators | 1 | — |
| Supply Voltage | 3.3 V / 5 V | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug | On-chip background debug (BGND instruction) | — |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS Status | RoHS compliant (per distributor listing) | Compliant |
| Lifecycle Status | NRND (Not Recommended for New Designs) per NXP | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| LCD Driver | — | Yes (on-chip segment LCD driver) |
| MSL Level | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |