MC9S08QE4CPG vs MC9S08QD4CSC Comparison

Detailed side-by-side comparison of MC9S08QE4CPG by NXP Semiconductors and MC9S08QD4CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QE4CPG MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG - 8-Bit 20MHz 4KB Flash MCU | NXP DIP-16

MC9S08QE4CPG ✓ Active
NXP Semiconductors
MC9S08QD4CSC MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC ✗ End of Life

Specification Comparison

Parameter MC9S08QE4CPG MC9S08QD4CSC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $2.05 $0.00
Core S08 (HCS08) 8-bit CPU —
CPU Maximum Frequency 20 MHz (50.33 MHz bus at VDD >= 2.1 V) —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 512 B 256 B
Supply Voltage (VDD) 1.8 V to 3.6 V —
Operating Temperature Range -40C to +85C (industrial) —
Package 16-pin PDIP (DIP-16, through-hole) 8-SOIC
I/O Pins Up to 12 general-purpose I/O (per 16-pin package) —
ADC Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] —
Timers Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] —
Communication SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] —
Low-Power Stop Mode Current Approx. 1 uA —
Debug Interface Background Debug Mode (BDM) Background debugging system (single-wire BDM)
Mounting Type Through-Hole (PDIP) Surface Mount
RoHS Status Compliant —
Family S08QE (Flexis, 8/32-bit pin-compatible family) —
Lifecycle Stage ACTIVE —
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-bit
Maximum Clock Frequency — 16 MHz
Flash Memory — 4 KB (4K x 8)
Supply Voltage — 3.3 V / 5 V
ADC Resolution — 10-bit
ADC Channels — 4
General-Purpose I/O — 6
Instruction Set — HC08 with added BGND instruction
Packaging — Tube
Operating Temperature — [DATA_NEEDED: operating temperature range]
Life Cycle Stage — End of Life (per NXP product page)

Datasheets & Resources

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