MC9S08QE4CPG vs MC9S08QD4CSC Comparaison
Comparaison détaillée côte à côte de MC9S08QE4CPG par NXP Semiconductors et MC9S08QD4CSC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QE4CPG | MC9S08QD4CSC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,05 | $0,00 |
| Core | S08 (HCS08) 8-bit CPU | — |
| CPU Maximum Frequency | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 512 B | 256 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | — |
| Plage de température de fonctionnement | -40C to +85C (industrial) | — |
| Boîtier | 16-pin PDIP (DIP-16, through-hole) | 8-SOIC |
| I/O Pins | Up to 12 general-purpose I/O (per 16-pin package) | — |
| ADC | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] | — |
| Timers | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] | — |
| Communication | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] | — |
| Low-Power Stop Mode Current | Approx. 1 uA | — |
| Debug Interface | Background Debug Mode (BDM) | Background debugging system (single-wire BDM) |
| Type de montage | Through-Hole (PDIP) | Surface Mount |
| Statut RoHS | Compliant | — |
| Family | S08QE (Flexis, 8/32-bit pin-compatible family) | — |
| Lifecycle Stage | ACTIVE | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Fréquence d'horloge maximale | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Tension d'alimentation | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |