MC9S08QE4CPG vs MC9S08QD4CSC Comparação
Comparação detalhada lado a lado de MC9S08QE4CPG por NXP Semiconductors e MC9S08QD4CSC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08QE4CPG | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2,05 | $0,00 |
| Core | S08 (HCS08) 8-bit CPU | — |
| CPU Maximum Frequency | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 512 B | 256 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | — |
| Faixa de temperatura de operação | -40C to +85C (industrial) | — |
| Encapsulamento | 16-pin PDIP (DIP-16, through-hole) | 8-SOIC |
| I/O Pins | Up to 12 general-purpose I/O (per 16-pin package) | — |
| ADC | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] | — |
| Timers | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] | — |
| Communication | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] | — |
| Low-Power Stop Mode Current | Approx. 1 uA | — |
| Debug Interface | Background Debug Mode (BDM) | Background debugging system (single-wire BDM) |
| Tipo de montagem | Through-Hole (PDIP) | Surface Mount |
| Status RoHS | Compliant | — |
| Family | S08QE (Flexis, 8/32-bit pin-compatible family) | — |
| Lifecycle Stage | ACTIVE | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frequência máxima de clock | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Tensão de alimentação | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |