MC9S08SH8MTG vs MC9S08QE8CWL Comparison

Detailed side-by-side comparison of MC9S08SH8MTG by NXP Semiconductors and MC9S08QE8CWL by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter MC9S08SH8MTG MC9S08QE8CWL
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $1.55 $3.33
Core Processor HCS08 (S08 core, 8-bit CISC) HCS08 (S08)
Core Size 8-bit 8-bit
Maximum CPU Frequency 40 MHz 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V
Program Memory (Flash) 8 KB (8K x 8) 8 KB (8K x 8)
RAM Size 512 x 8 (512 B) —
EEPROM Size Not present (Flash-only) —
Operating Voltage Range 2.7 V to 5.5 V —
Number of I/O Pins 13 —
Package 16-pin TSSOP (Tape and Reel) 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch)
Mounting Type Surface Mount Surface Mount
Connectivity I2C, LINbus, SCI, SPI I2C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT, ACMP LVD, PWM, 16-bit Timer (TPM), BDM
ADC 12-channel, 10-bit, 2.5 µs conversion —
Temperature Sensor Internal (ADC channel) —
Interrupt Sources Up to 32 —
Debug Interface BDM (Background Debug Mode) Single-wire Background Debug Mode (BDM)
Lead-Free / RoHS Yes (per Mouser listing) —
Operating Temperature [DATA_NEEDED: operating temperature range] -40 C to +85 C
Core Architecture — CISC, Harvard, 3-stage pipeline
RAM — 512 B
Supply Voltage (VDD) — 1.8 V to 3.6 V
I/O Pins — 28
PWM Channels — Up to 6
ROM Type — Flash
RoHS Status — Compliant (per NXP product page)
Series — S08QE Flexis
Mounting Style — Surface Mount
Family — MC9S08

Datasheets & Resources

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