MC9S12B256MFUE vs MC9S12DT256MFUE Comparison
Detailed side-by-side comparison of MC9S12B256MFUE by NXP Semiconductors and MC9S12DT256MFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ ActiveSpecification Comparison
| Parameter | MC9S12B256MFUE | MC9S12DT256MFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.60 | $19.20 |
| Core | HCS12 (16-bit CISC) | — |
| CPU Family | S12B (MC9S12B series) | — |
| Maximum CPU Clock | 25 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 12 KB | [DATA_NEEDED: RAM size] |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| Supply Voltage | 2.35 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | 16-channel, 10-bit (per family) |
| PWM Module | 8-channel, 8-bit | 8-channel 16-bit PWM |
| CAN (msCAN) | 1 x CAN 2.0A/B | — |
| SCI / SPI / I2C | Yes (1 each) | — |
| Enhanced Capture Timer | 6 x 16-bit channels | — |
| Operating Temperature | -40 C to +125 C (junction) | — |
| Package | 80-QFP, 14 x 14 mm, 1.0 mm pitch | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lifecycle | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS12 (CPU12), 16-bit CISC |
| Maximum CPU Frequency | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| Data Bus Width | — | 16-bit |
| Operating Supply Voltage (Core) | — | 2.35 V to 2.75 V |
| I/O Supply Voltage | — | 5V-tolerant I/O on VDDR/VSSR |
| Number of I/O Pins | — | 91 |
| Package Type | — | 80-QFP (PQFP/LQFP-80, 14x14 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 80 |
| Temperature Grade | — | Automotive |
| On-chip CAN Module | — | MSCAN (CAN 2.0A/B) |
| Communication Peripherals | — | SCI, SPI, IIC, BDLC |