MC9S12B256MFUE vs MC9S12DT256MFUE 비교

다음의 상세 나란히 비교: MC9S12B256MFUE 제조: NXP Semiconductors 및 MC9S12DT256MFUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12B256MFUE MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ 활성

사양 비교

파라미터 MC9S12B256MFUE MC9S12DT256MFUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $21.60 $19.20
Core HCS12 (16-bit CISC) —
CPU Family S12B (MC9S12B series) —
Maximum CPU Clock 25 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 12 KB [DATA_NEEDED: RAM size]
EEPROM 4 KB [DATA_NEEDED: EEPROM size]
공급 전압 2.35 V to 5.5 V —
ADC 10-bit, 8-channel 16-channel, 10-bit (per family)
PWM Module 8-channel, 8-bit 8-channel 16-bit PWM
CAN (msCAN) 1 x CAN 2.0A/B —
SCI / SPI / I2C Yes (1 each) —
Enhanced Capture Timer 6 x 16-bit channels —
동작 온도 -40 C to +125 C (junction) —
패키지 80-QFP, 14 x 14 mm, 1.0 mm pitch —
실장 유형 Surface Mount Surface Mount
MSL 레벨 3 (168 hours) [DATA_NEEDED: MSL level]
RoHS 상태 Compliant [DATA_NEEDED: RoHS status]
Debug Interface BDM (Background Debug Mode) —
Lifecycle NRND (Not Recommended for New Designs) —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Maximum CPU Frequency — 25 MHz
Flash Memory — 256 KB (256K x 8)
데이터 버스 폭 — 16-bit
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Number of I/O Pins — 91
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
Temperature Grade — Automotive
On-chip CAN Module — MSCAN (CAN 2.0A/B)
Communication Peripherals — SCI, SPI, IIC, BDLC

데이터시트 & 자료

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