MC9S12D64MPVE vs MC9S12DT256CPVE Comparison

Detailed side-by-side comparison of MC9S12D64MPVE by NXP Semiconductors and MC9S12DT256CPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

Specification Comparison

Parameter MC9S12D64MPVE MC9S12DT256CPVE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $9.84 $20.85
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) 256 KB (256K x 8) Flash
RAM Size 4 KB 12 KB
Number of I/O 91 —
Package / Case 112-LQFP (20 x 20 mm) —
Oscillator Type Internal —
Operating Supply Voltage 2.5 V / 5 V —
ADC Two 8-channel, 10-bit 2x 8-channel, 10-bit
PWM Channels 8 8 channels
Timers 8-channel IC/OC enhanced capture timer 8-channel Enhanced Capture Timer (ECT)
Serial Interfaces 2x SCI (asynchronous) —
I2C (Inter-IC Bus) Yes —
Mounting Type Surface Mount Surface Mount
Packaging Tray —
RoHS Status Compliant [DATA_NEEDED: RoHS status from manufacturer]
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
Maximum Clock Frequency — 25 MHz
EEPROM Size — 4 KB
Data Bus Width — 16-bit
Supply Voltage — 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
Number of I/O Pins — 91
Connectivity — CAN, I2C, SCI (UART), SPI
Package — 112-pin LQFP (20x20 mm)
Operating Temperature — -40C to +85C (industrial, per 'P' suffix family)
Debug Interface — BDM (Background Debug Mode)
Watchdog — COP (Computer Operating Properly) watchdog

Datasheets & Resources

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