MC9S12DT256MFUE vs MC9S12DT256MPVE Comparison
Detailed side-by-side comparison of MC9S12DT256MFUE by NXP Semiconductors and MC9S12DT256MPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ ActiveNXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndSpecification Comparison
| Parameter | MC9S12DT256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $19.20 | $14.36 |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 12 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 4 KB |
| Data Bus Width | 16-bit | 16-bit |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM Module | 8-channel 16-bit PWM | — |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 256 KB |
| Supply Voltage | — | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Package | — | 112-LQFP (20x20 mm) |
| Operating Temperature | — | -40C to +125C (automotive grade) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |