MC9S12DT256MFUE vs MC9S12DT256MPVE Comparação
Comparação detalhada lado a lado de MC9S12DT256MFUE por NXP Semiconductors e MC9S12DT256MPVE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AtivoNXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndComparação de especificações
| Parâmetro | MC9S12DT256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $19,20 | $14,36 |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 12 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 4 KB |
| Largura do barramento de dados | 16-bit | 16-bit |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM Module | 8-channel 16-bit PWM | — |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 256 KB |
| Tensão de alimentação | — | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Encapsulamento | — | 112-LQFP (20x20 mm) |
| Temperatura de operação | — | -40C to +125C (automotive grade) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) |