MC9S12DT256MFUE vs MC9S12DT256MPVE Vergleich
Detaillierter Direktvergleich von MC9S12DT256MFUE von NXP Semiconductors und MC9S12DT256MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AktivNXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndSpezifikationsvergleich
| Parameter | MC9S12DT256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,20 | $14,36 |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 12 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 4 KB |
| Datenbusbreite | 16-bit | 16-bit |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM Module | 8-channel 16-bit PWM | — |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 256 KB |
| Versorgungsspannung | — | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Gehäuse | — | 112-LQFP (20x20 mm) |
| Betriebstemperatur | — | -40C to +125C (automotive grade) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |