MC9S12E64MPVE vs MC9S12DG256CVPV Comparison

Detailed side-by-side comparison of MC9S12E64MPVE by NXP Semiconductors and MC9S12DG256CVPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12E64MPVE MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP

MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP

MC9S12E64MPVE Nrnd

Specification Comparison

Parameter MC9S12E64MPVE MC9S12DG256CVPV
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $10.55 $12.40
Core HCS12 (16-bit CISC) —
Program Memory (Flash) 64 KB (64K x 8) 256 KB
RAM Size 4 KB (4K x 8) —
Maximum CPU Clock / Bus Speed 25 MHz —
Operating Supply Voltage 2.5 V / 3.3 V / 5 V —
Number of I/O 92 —
Package / Case 112-LQFP (20 x 20 mm) —
Mounting Type Surface Mount Surface Mount
Terminal Form GULL WING —
Number of Terminals 112 —
Package Shape SQUARE —
Temperature Grade Automotive (per Partstack listing) —
CAN Controllers Up to 2 x MSCAN (CAN 2.0A/B) [DATA_NEEDED: exact count per mask] —
ADC 8-channel, 10-bit [DATA_NEEDED: channels per mask set] 2x 8-channel, 10-bit
PWM 8-channel [DATA_NEEDED: resolution] —
Debug Interface Background Debug Mode (BDM) —
RoHS Status Compliant (per ETEI comparison) Compliant
REACH Status Compliant (per ETEI comparison) —
Series HCS12 —
Core Architecture — HCS12 (16-bit CISC)
Core Frequency — 25 MHz
RAM — 12 KB
EEPROM — 4 KB
Data Bus Width — 16-bit
Package — 112-LQFP (20x20 mm)
Supply Voltage — 2.97 V to 5.5 V
Operating Temperature — -40C to +85C (industrial)
I/O Pins — 91
PWM Channels — 8
Capture Timer — 8-channel enhanced
Communication Interfaces — 2x SCI, CAN, SPI, I²C
MSL Level — 3 (168 hours)

Datasheets & Resources

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