MC9S12P128MQK vs MC9S12H256VFVE Comparison
Detailed side-by-side comparison of MC9S12P128MQK by NXP Semiconductors and MC9S12H256VFVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12H256VFVE - 16-Bit 256KB Flash HCS12 MCU | NXP | 144-LQFP (Tape & Reel)
MC9S12H256VFVE ObsoleteSpecification Comparison
| Parameter | MC9S12P128MQK | MC9S12H256VFVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6.10 | $10.95 |
| Core Architecture | HCS12 / CPU12 (16-bit) | CISC |
| Program Memory | 128 KB Flash | — |
| Data RAM | 6 KB | 12 KB |
| Maximum CPU Frequency | 32 MHz | — |
| Data Bus Width | 16-bit | — |
| Number of I/Os | 64 I/O | — |
| ADC Resolution | 12-bit | — |
| Supply Voltage | 3.15 V to 5.5 V | 2.5 V core / 5 V I/O |
| Operating Temperature | -40 °C to +125 °C (Automotive) | -40 C to +105 C (automotive) |
| Mounting Style | SMD/SMT | — |
| Package | QFP-80 (LQFP-80, 14x14 mm) | 144-LQFP (20 x 20 mm) |
| Terminal Form | GULL WING | — |
| Communications | CAN, SCI, SPI | — |
| Programming Interface | Background Debug Mode (BDM) | — |
| Temperature Grade | Automotive | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | HCS12 CPU12 |
| Core Size | — | 16-Bit |
| Maximum Clock Frequency | — | 16 MHz |
| Program Memory Size | — | 256 KB (256K x 8) FLASH |
| EEPROM | — | 4 KB |
| Number of I/O Pins | — | 99 |
| Mounting Type | — | Surface Mount |
| Connectivity | — | CANbus (2x), I2C, SCI, SPI |
| Peripherals | — | LCD driver, POR, PWM, WDT |
| Automotive Qualification | — | AEC-Q100 |
| MSL Level | — | 3 (168 hours) |