MC9S12P128MQK vs MC9S12H256VFVE Vergleich
Detaillierter Direktvergleich von MC9S12P128MQK von NXP Semiconductors und MC9S12H256VFVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12H256VFVE - 16-Bit 256KB Flash HCS12 MCU | NXP | 144-LQFP (Tape & Reel)
MC9S12H256VFVE ObsoleteSpezifikationsvergleich
| Parameter | MC9S12P128MQK | MC9S12H256VFVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,10 | $10,95 |
| Core Architecture | HCS12 / CPU12 (16-bit) | CISC |
| Program Memory | 128 KB Flash | — |
| Data RAM | 6 KB | 12 KB |
| Maximum CPU Frequency | 32 MHz | — |
| Datenbusbreite | 16-bit | — |
| Number of I/Os | 64 I/O | — |
| ADC Resolution | 12-bit | — |
| Versorgungsspannung | 3.15 V to 5.5 V | 2.5 V core / 5 V I/O |
| Betriebstemperatur | -40 °C to +125 °C (Automotive) | -40 C to +105 C (automotive) |
| Montagestil | SMD/SMT | — |
| Gehäuse | QFP-80 (LQFP-80, 14x14 mm) | 144-LQFP (20 x 20 mm) |
| Terminal Form | GULL WING | — |
| Communications | CAN, SCI, SPI | — |
| Programming Interface | Background Debug Mode (BDM) | — |
| Temperature Grade | Automotive | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | HCS12 CPU12 |
| Core Size | — | 16-Bit |
| Maximale Taktfrequenz | — | 16 MHz |
| Program Memory Size | — | 256 KB (256K x 8) FLASH |
| EEPROM | — | 4 KB |
| Number of I/O Pins | — | 99 |
| Montageart | — | Surface Mount |
| Connectivity | — | CANbus (2x), I2C, SCI, SPI |
| Peripherals | — | LCD driver, POR, PWM, WDT |
| Automotive Qualification | — | AEC-Q100 |
| MSL-Level | — | 3 (168 hours) |